Solder Paste Flux 10cc RMA-223 PCB PGA BGA SMD

The RMA-223 is a high viscosity no-clean flux, it can be used for PCB, BGA, PGA reworking. It can be used for soldering and reballing of computer and phone chips. It has a high viscosity no-clean flux. It is the mixture of high-quality alloyed powder and resinic pasted flux.

Features:
– Suitable for BGA ball, semiconductor packaging, repair.
– Computer motherboard north and south bridge, communications, graphics and other BGA apply.
– Just apply a little each time.
– It’s currently the best on the market BGA, CSP rework help paste.
– When the bumping of the BGA chip coated with flux paste and PCB pads are required coat.
– Good BGA soldering flux paste and machine regardless of manual welding, the success rate is greatly increased.

Specifications:
Material: tin+ solder paste
Capacity: 10cc/10ml
Size: Approx.: 3.3×3.2×2.9cm

Package Includes:
1 x 10cc RMA-223 PCB Solder Paste (needle or pushing tool not included)